Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

387 страницы · 2012 · 4.05 MB · английский
by Er?Ping Li(auth.) & Lajos Hanzo(eds.)
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